Title:
光硬化性・熱硬化性樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP4087650
Kind Code:
B2
Abstract:
PURPOSE: To provide a photosetting/thermosetting resin composition which has excellent flexibility, has little warpage after cured, has well-balanced characteristics in the development, photosetting performance and plating resistance and is alkali soluble and to provide a cured material thereof. CONSTITUTION: The photosetting/thermosetting resin comprises a photosetting resin obtained by reacting saturated and unsaturated polybasic acid anhydride(c) with a reaction product between bisphenol-type polyfunctional epoxy resin(a) and unsaturated monocarboxylic acid(b), a photosetting resin obtained by reacting the saturated and unsaturated polybasic acid anhydride(c) with a reaction product between polyfunctional epoxy compound(a') having a regular repeated unit by means of an ester bond and the unsaturated monocarboxylic acid(b), a photosetting initiator, an epoxy curing catalyst, a diluent and an epoxy compound(F) having two or more pieces of epoxy groups in one molecule.
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Inventors:
Yuta Ogawa
Chitani Imaki
Chitani Imaki
Application Number:
JP2002203523A
Publication Date:
May 21, 2008
Filing Date:
July 12, 2002
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C08G59/24; G03F7/027; C08G59/38; C08L63/10; G03F7/004; G03F7/032; H05K3/28
Domestic Patent References:
| JP2001324805A | ||||
| JP11240930A | ||||
| JP9054434A | ||||
| JP8134390A | ||||
| JP11065117A | ||||
| JP9311446A |
Foreign References:
| WO2002077058A1 |