Title:
電気光配線基板及び半導体装置
Document Type and Number:
Japanese Patent JP4112448
Kind Code:
B2
Abstract:
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
Inventors:
Hiroshi Yamada
Keiji Takaoka
Hideto Koyama
Keiji Takaoka
Hideto Koyama
Application Number:
JP2003202491A
Publication Date:
July 02, 2008
Filing Date:
July 28, 2003
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/12; G02B6/12; G02B6/43; H05K1/02; G02B6/42; H05K1/18; H05K3/46
Domestic Patent References:
| JP61079290A | ||||
| JP2002237684A | ||||
| JP2002040274A | ||||
| JP2001318250A | ||||
| JP2001183556A | ||||
| JP2002182049A | ||||
| JP2003179361A | ||||
| JP2003172828A | ||||
| JP58140185A | ||||
| JP2000340907A | ||||
| JP2005017394A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu