Title:
低膨張材料及びその製造方法
Document Type and Number:
Japanese Patent JP4113971
Kind Code:
B2
Abstract:
Fabrication of a material with low expansion comprises filling a mold with particles of non-fired SiC and casting pure aluminum or an Al alloy containing Si in the mold at high pressure.
Inventors:
Chihei Sugiyama
Kyoichi Kinoshita
Takashi Yoshida
Hidehiro Kudo
Eiji Kono
Kyoichi Kinoshita
Takashi Yoshida
Hidehiro Kudo
Eiji Kono
Application Number:
JP2003131402A
Publication Date:
July 09, 2008
Filing Date:
May 09, 2003
Export Citation:
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
International Classes:
H01L23/373; B22D19/14; C04B35/565; C04B35/653; C04B41/50; C04B41/51; C22C1/10; H01L21/48; H01L23/15
Domestic Patent References:
| JP11087581A | ||||
| JP2002047545A | ||||
| JP2002066724A | ||||
| JP2000141022A | ||||
| JP11050173A | ||||
| JP2001332827A | ||||
| JP2000340721A | ||||
| JP2001144234A | ||||
| JP8092671A | ||||
| JP4028835A |
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Yoshikazu Takei
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Yoshikazu Takei