Title:
建物
Document Type and Number:
Japanese Patent JP4128948
Kind Code:
B2
Abstract:
To provide an underfloor heating device capable of improving the energy consumption efficiency of a heat pump.
The heat pump 5 is installed outdoor, the hot water heated by the heat pump 5 is sent to a radiator 2b mounted on an underfloor space 2a of a house place 2 first by a circulating passage 6 to heat the underfloor space 2a, then continuously sent to a radiator 3b mounted on an underfloor space 3a of a kitchen 3 and a radiator 4b laid on an underfloor space 4a of a corridor, when a temperature of a heat medium is lowered to be less than a specific set temperature, and returned to the heat pump 5 to be circulated.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Daisuke Asagiri
Application Number:
JP2003430724A
Publication Date:
July 30, 2008
Filing Date:
December 25, 2003
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
F24D3/14; F25B6/04
Domestic Patent References:
| JP2003090547A | ||||
| JP2002061854A |