Title:
半導体装置の放熱構造
Document Type and Number:
Japanese Patent JP4140452
Kind Code:
B2
Inventors:
Takao Hayakawa
Application Number:
JP2003163431A
Publication Date:
August 27, 2008
Filing Date:
June 09, 2003
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L23/34; H01L23/40; H01L25/07; H01L25/18
Domestic Patent References:
| JP11177002A | ||||
| JP10340975A | ||||
| JP2002368170A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida