Title:
研磨パッド、および細長いマイクロカラムを有する研磨パッドを作製する方法
Document Type and Number:
Japanese Patent JP4147330
Kind Code:
B2
Abstract:
A polishing pad for use in chemical-mechanical planarization (CMP) of semiconductor wafers includes a multiplicity of elongated microcolumns embedded in a matrix material body. The elongated microcolumns are oriented parallel to each other and extend from a planarizing surface used to planarize the semiconductor wafers. The elongated microcolumns are uniformly distributed throughout the polishing pad in order to impart uniform properties throughout the polishing pad. The polishing pad can also include elongated pores either coaxial width or interspersed between the elongated microcolumns to provide uniform porosity throughout the polishing pad.
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Inventors:
Dawn, Trung Tori
Mayle, Scott G.
Mayle, Scott G.
Application Number:
JP51683198A
Publication Date:
September 10, 2008
Filing Date:
September 30, 1997
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24B37/26; B24D11/00; B24D13/14; H01L21/304
Domestic Patent References:
| JP8229805A | ||||
| JP6208980A | ||||
| JP6114742A | ||||
| JP5253852A | ||||
| JP7321076A | ||||
| JP2250776A | ||||
| JP8174399A | ||||
| JP7068460A | ||||
| JP8025205A | ||||
| JP6333893A | ||||
| JP7328926A | ||||
| JP62021857A | ||||
| JP4500584A | ||||
| JP8500622A | ||||
| JP8500298A | ||||
| JP8502232A | ||||
| JP8195365A | ||||
| JP8336752A | ||||
| JP7256554A |
Foreign References:
| US5533923 |
Attorney, Agent or Firm:
Nomura Yasuhisa
Yoshiyuki Osuga
Yoshiyuki Osuga