Title:
ラベル付き筒状包装フイルム
Document Type and Number:
Japanese Patent JP4151805
Kind Code:
B2
Inventors:
Riki Nakamura
Application Number:
JP13418598A
Publication Date:
September 17, 2008
Filing Date:
April 07, 1998
Export Citation:
Assignee:
Fuji Seal International Co., Ltd.
International Classes:
B65D71/08; G09F3/00
Domestic Patent References:
| JP1123876U | ||||
| JP62019966U | ||||
| JP59186262U |
Previous Patent: ホログラム複製方法
Next Patent: MANUFACTURE OF SEMICONDUCTOR CERAMIC COMPOUND FOR VOLTAGE NON-LINEAR RESISTOR
Next Patent: MANUFACTURE OF SEMICONDUCTOR CERAMIC COMPOUND FOR VOLTAGE NON-LINEAR RESISTOR