Title:
センサ装置、とりわけマイクロメカニカルセンサ装置
Document Type and Number:
Japanese Patent JP4154245
Kind Code:
B2
Abstract:
A sensor array, in particular a micromechanical sensor array, and methods for manufacturing the sensor array are provided, which sensor array includes a sensor section for supplying certain sensor signals, and a cover section provided on the sensor section to form a hermetically sealed sensor interior. An electronic analyzer device is at least partially integratable into cover section for analysis of the sensor signals, and electrically connectable to a corresponding circuit device of the sensor section.
Inventors:
Joachim Luthard
Claus hiers
Claus hiers
Application Number:
JP2002589755A
Publication Date:
September 24, 2008
Filing Date:
April 19, 2002
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
G01C19/56; B81B3/00; B81B7/00; B81B7/02; B81C3/00; G01P1/02; G01P9/04; G01P15/08
Domestic Patent References:
| JP2000186931A |
Foreign References:
| US5831162 | ||||
| DE19820816A1 |
Attorney, Agent or Firm:
Toshio Yano
Einzel Felix-Reinhard
Reinhard Einsel
Einzel Felix-Reinhard
Reinhard Einsel