To improve a transparent film that forms an optical waveguide unit in embedding properties so as to improve a semiconductor image pick-up device in light condensing efficiency when an aspect ratio becomes higher as a semiconductor image pick-up device gets to have more multilayer interconnections and more pixels.

This semiconductor image pick-up device is equipped with a silicon board 11 provided with a photodiode 15, wirings 19A and 19B connected to the silicon board 11, an interlayer insulating film 21 which is formed on the silicon board 11 with the photodiode 15 so as to insulate the wirings 19A and others, and a multistage opening-width optical waveguide unit 22 which is provided to a part other than the wirings 19A and 19B above the photodiode 15, penetrating through the interlayer insulating film 21. The optical waveguide unit 22 has a multistage opening-width structure in which an opening width w1 at its uppermost part is larger than that w2 at its lowermost part.

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