Title:
信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
Document Type and Number:
Japanese Patent JP4173306
Kind Code:
B2
Abstract:
A reliability evaluation test apparatus (10) of this invention includes a wafer storage section (12) which stores a wafer (W) in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor (11) are totally in electrical contact with each other. The wafer storage section (12) transmits/receives a test signal to/from a measurement section (15) and has a hermetic and heat insulating structure. The wafer storage section (12) has a pressure mechanism (13) which presses the contactor (11) and a heating mechanism (14) which directly heats the wafer (W) totally in contact with the contactor (11) to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
Inventors:
Kiyoshi Takekoshi
Hosaka Hisatomi
Junichi Hagiwara
Katsuhiko Hatsuka
Takako Usui
Naofumi Kaneko
Nobuo Hayasaka
Yoshiyuki Ido
Hosaka Hisatomi
Junichi Hagiwara
Katsuhiko Hatsuka
Takako Usui
Naofumi Kaneko
Nobuo Hayasaka
Yoshiyuki Ido
Application Number:
JP2001367268A
Publication Date:
October 29, 2008
Filing Date:
November 30, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
株式会社東芝
イビデン株式会社
株式会社東芝
イビデン株式会社
International Classes:
G01R31/26; H01L21/66; G01R1/04; G01R31/28; G01R31/30
Domestic Patent References:
| JP11163066A | ||||
| JP11330188A | ||||
| JP2001203244A | ||||
| JP2002329759A |
Attorney, Agent or Firm:
Hajime Ohara
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