Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
インプラントを移植するためのシステムおよびその方法
Document Type and Number:
Japanese Patent JP4181410
Kind Code:
B2
Abstract:
A system for implanting an implant and method thereof is disclosed. In general overview, the system includes an implant, an envelope enclosing the implant, a delivery assembly and an attachment piece for attaching the envelope or implant to the delivery assembly. The envelope may include a drug coating, positioning aids, and means to ease envelope removal. In one embodiment, the delivery assembly is employed for implant and/or envelope delivery inside the patient's body. In another embodiment, the delivery assembly and an attachment piece are employed to deliver the implant or the envelope inside the patient's body.

More Like This:
WO/2023/013982LIFTING THREAD HAVING FLEXIBLE VARIABLE PART
JP2000515774INDUSTRIAL APPLICABILITY A device for linear high-frequency catheter ablation of endocardial myocardial tissue.
JP2022553074System and method for opening tissue
Inventors:
Germain, Barry N.
Li, Jiang Min
Morin, Armand
Slanda, joseph
Tar, Richard
Application Number:
JP2002570915A
Publication Date:
November 12, 2008
Filing Date:
March 07, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Boston Scientific Limited
International Classes:
A61B17/00; A61B17/03; A61F2/00; A61F2/04; A61F2/48; A61L27/00; A61B17/04; A61B17/06; A61B17/34
Domestic Patent References:
JP10506803A
JP2502612A
JP2001511685A
Foreign References:
US6042534
WO1999063907A1
US6135945
US6095969
US6110101
US5934283
US6010447
US6162238
US5899909
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita



 
Previous Patent: ニューロキニン１アンタゴニストとしてのピペリジン誘導体

Next Patent: SYSTEM FOR LOADING/UNLOADING ELECTRONIC PARTS