Title:
積層体の製造方法及び積層体
Document Type and Number:
Japanese Patent JP4185912
Kind Code:
B2
Abstract:
In view of the above discussed state of the art, it is an object of the present invention to provide a method of producing a laminate excellent in insulation and adhesion strength between a functional material and conductive material sandwiching that, without needing any organic solvent in production thereof, and laminates produced thereby. A method of producing a laminate which comprises the step (1) of forming, on each of two conductive materials, an adhesive resin layer by an electrodeposition step with a cationic electrodepositable adhesive composition comprising a cationic resin composition and the step (2) of joining the adhesive resin layer on each conductive material as obtained in the step (1) to each side of a functional material.
Inventors:
Hiroyuki Sakamoto
Black saki
Toshitaka Kawanami
Kazuo Morinaka
Takao Saito
Black saki
Toshitaka Kawanami
Kazuo Morinaka
Takao Saito
Application Number:
JP2004537589A
Publication Date:
November 26, 2008
Filing Date:
September 18, 2003
Export Citation:
Assignee:
NIPPON PAINT CO.,LTD.
International Classes:
B32B27/00; B32B15/08; B32B37/12; B32B37/16; C09J5/00; C09J9/02; H05K3/38; C08L63/00
Domestic Patent References:
| JP9157621A | ||||
| JP2967539B2 | ||||
| JP2001226640A | ||||
| JP2002161126A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office