Title:
ICソケット
Document Type and Number:
Japanese Patent JP4187333
Kind Code:
B2
Abstract:
There is provided an IC socket, which can peel out oxide films covering the surface of a terminal of IC and that of a wiring, and which can reduce inductance components. A first inclined side of a contact pin comes in contact with an actuating portion of a press lever, a second inclined side thereof comes in contact with rubber, and an engaging portion of the contact pin is supported by a contact pin support member. In a state in which contact portions of the contact pin come in contact with a terminal of IC and a wiring, if the first inclined side of the contact pin is further pressed by an actuating portion of the press lever, the contact pin deforms rubber and moves as rubbing the terminal of IC and the wiring. Thus, since the rubber is elastically deformed, there is no need to deform the contact pin itself elastically, so that the contact pin can be downsized.
Inventors:
Takeshi Yamamoto
Application Number:
JP37683298A
Publication Date:
November 26, 2008
Filing Date:
December 25, 1998
Export Citation:
Assignee:
Enplus Inc.
International Classes:
H01R33/76; G01R1/04; G01R31/26
Domestic Patent References:
| JP9074156A | ||||
| JP10116670A | ||||
| JP63300977A | ||||
| JP63301476A |
Attorney, Agent or Firm:
Hiroyoshi Katsumata