Title:
半導体封止用樹脂組成物及び樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP4207101
Kind Code:
B2
Inventors:
Nagase Hideo
Teruki Aizawa
Yasuyuki Hirai
Ken Nanami
Fumio Furusawa
Ryoichi Ikezawa
Mitsuo Katayose
Tendo Ichiyoshi
Seiichi Akagi
Teruki Aizawa
Yasuyuki Hirai
Ken Nanami
Fumio Furusawa
Ryoichi Ikezawa
Mitsuo Katayose
Tendo Ichiyoshi
Seiichi Akagi
Application Number:
JP14472899A
Publication Date:
January 14, 2009
Filing Date:
May 25, 1999
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L61/34; C08G59/40; C08L61/06; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2000248151A | ||||
| JP11001604A | ||||
| JP11060898A | ||||
| JP4227922A | ||||
| JP10251380A |