To provide an imaging apparatus, wherein an imaging element which is adhered on a film substrate and a wiring pattern of the film substrate are connected stably, and enabling positioning.

The imaging apparatus is provided with the imaging element 4, the film substrate 10 and a lead 2a for connection. The film substrate 10 has a wiring 2, on which the imaging element is mounted and in which a surface and a back surface are coated with insulating films 10a, and has a crooked portion which is bent toward the main surface of the imaging element, in the vicinity of a ridge of the imaging element. The lead 2a is formed, by extending the wiring pattern from an end which is bent toward the main surface of the imaging element on the film substrate and electrically connected to a bump electrode of the imaging element. The insulating film is partially eliminated in the bent portion. Alternatively, the insulating film is formed thin at the bent portion.

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