Title:
半導体装置及び配置配線方法
Document Type and Number:
Japanese Patent JP4232375
Kind Code:
B2
Inventors:
Torii Kensuke
Application Number:
JP2002070956A
Publication Date:
March 04, 2009
Filing Date:
March 14, 2002
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/82; H01L21/8234; H01L27/088; H01L27/118
Domestic Patent References:
| JP2001358301A | ||||
| JP2000294654A | ||||
| JP4192358A | ||||
| JP60066446A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa