Title:
回路パターン形成装置および回路パターン形成方法
Document Type and Number:
Japanese Patent JP4241675
Kind Code:
B2
Abstract:
A circuit pattern forming device includes a liquid ejection device that ejects an insulating pattern forming solution and a conductive pattern forming solution onto a substrate to form insulating dots of the insulating solution and conductive dots of the conductive solution on the substrate. A control device controls an ejection operation that the liquid ejection device performs for each of the solutions. A moving device moves the liquid ejection device and the substrate relative to each other to form a circuit pattern composed of a plurality of the conductive dots and the insulating dots. The liquid ejection device includes a first nozzle array in which a plurality of nozzles for ejecting the insulating solution are arranged along a crossing direction crossing a main scan direction, and a second nozzle array in which a plurality of nozzles for ejecting the conductive solution are arranged along the crossing direction. The first nozzle array is disposed in front of the second nozzle array with respect to the main scan direction and the second nozzle array is arranged between a plurality of the first nozzle arrays. When the insulating dots and the conductive dots are formed close to each other on the substrate, the insulating dots, which are positioned in a direction in which the liquid ejection device moves relative to the substrate, are formed on the substrate prior to the conductive dots in a same main scan performed by the liquid ejection device.
Inventors:
Takashi Mori
Yuji Tsuruoka
Furukawa Masao
Seiichi Kamiya
Yamaguchi Atsuto
Yuji Tsuruoka
Furukawa Masao
Seiichi Kamiya
Yamaguchi Atsuto
Application Number:
JP2005181625A
Publication Date:
March 18, 2009
Filing Date:
June 22, 2005
Export Citation:
Assignee:
Canon Inc
International Classes:
H05K3/10
Domestic Patent References:
| JP11274671A |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe