Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP4255237
Kind Code:
B2
Inventors:
Tetsuya Wada
Application Number:
JP2002052856A
Publication Date:
April 15, 2009
Filing Date:
February 28, 2002
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
C23C16/455; H01L21/205
Domestic Patent References:
| JP6124903A | ||||
| JP2000012534A | ||||
| JP10168572A |
Attorney, Agent or Firm:
Patent Business Corporation IPS