Title:
粘着テ-プ
Document Type and Number:
Japanese Patent JP4258895
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an adhesive tape capable of being readily peeled off from a separate paper, and having a large adhesive force and a large initial adhesive force to various substrates such as a ceramic substrate, an electroconductive metal and the self back surface of a heat-resistant film of a supporter. SOLUTION: This adhesive tape is obtained by laminating a silicone adhesive having <=50 μm thickness on one surface of a heat-resistant film having >=600 kg/mm2 tensile modulus, >=30% elongation and <=15 μm thickness.
Inventors:
Ken Kamikido
Toshiyuki Nishino
Takuhiro Ishii
Toshiyuki Nishino
Takuhiro Ishii
Application Number:
JP19717699A
Publication Date:
April 30, 2009
Filing Date:
July 12, 1999
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C09J7/02; C09J183/04
Domestic Patent References:
| JP11149978A | ||||
| JP11043657A | ||||
| JP10298509A | ||||
| JP10072573A | ||||
| JP7197007A |