Title:
実装基板及び実装基板を用いたバルブソケット
Document Type and Number:
Japanese Patent JP4270865
Kind Code:
B2
Abstract:
A mounting board has a board, retaining members mounted on the upper surface of the board, and a part retained by the retaining members. The part is mounted such that at least a part thereof is arranged below the lower surface of the board, and that the part is electrically connected to the board through the retaining members. Such an arrangement as described above eliminates the need of connecting the discharge gap element to the board by using lead wires, and of mounting it on the upper surface of the board. This lowers the height of the board and admits an elevated part.
Inventors:
Fumihiro Minami
Yukari Yamazaki
Mutsuo Sekiya
Yukari Yamazaki
Mutsuo Sekiya
Application Number:
JP2002521423A
Publication Date:
June 03, 2009
Filing Date:
August 17, 2001
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K1/18; H01R33/76; H01R33/945; H05B41/02; H05K3/30; H01R33/975
Domestic Patent References:
| JP62134224U | ||||
| JP4158603A | ||||
| JP60961U | ||||
| JP3057187U | ||||
| JP3054819U | ||||
| JP591142U | ||||
| JP3136938A | ||||
| JP669053A | ||||
| JP7114805A |
Attorney, Agent or Firm:
Hideaki Tazawa
Hamada Hatsune
Hamada Hatsune