Title:
半導体装置用接続装置、半導体装置キャリア、半導体装置用ソケット、および、プローブカード
Document Type and Number:
Japanese Patent JP4283269
Kind Code:
B2
Abstract:
A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.
Inventors:
Takeyuki Suzuki
Application Number:
JP2005363829A
Publication Date:
June 24, 2009
Filing Date:
December 16, 2005
Export Citation:
Assignee:
Yamaichi Electric Co., Ltd.
International Classes:
H01R33/76; G01R1/06; G01R31/26; H01L21/66; H01L23/32
Domestic Patent References:
| JP2004047186A | ||||
| JP2006105692A |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe