Title:
銅電解液およびそれにより製造された電解銅箔
Document Type and Number:
Japanese Patent JP4294593
Kind Code:
B2
Abstract:
It is an object of the present invention to provide a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum, and more particularly to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at high frequency, can be finely patterned, and has excellent elongation and tensile strength both at ordinary temperature and high temperature. The copper electrolytic solution of the present invention contains as additives (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.
Inventors:
Masashi Kumagai
Mikio Hanafusa
Mikio Hanafusa
Application Number:
JP2004560597A
Publication Date:
July 15, 2009
Filing Date:
October 10, 2003
Export Citation:
Assignee:
Nikko Metal Co., Ltd.
International Classes:
C25D1/00; C23C18/38; C25D1/04; C25D3/38
Domestic Patent References:
| JP2001271196A | ||||
| JP2000297395A | ||||
| JP6220278B2 | ||||
| JP57188693A |
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Jun Komatsu
Norio Kagami
Jun Komatsu
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