Title:
レーザ加工装置
Document Type and Number:
Japanese Patent JP4297952
Kind Code:
B2
Abstract:
The invention acquires a laser processing device capable of narrowing the difference of processing qualities of two beams of lasers in synchronous multi-point irradiation laser processing device, so as to realize improvement of processing quality. The laser processing device includes: a first polarization unit which divides a beam of laser into 2 beams of lasers (Lalpha, Lbeta) having different light paths; an electric scanner which is configured on the light path of the laser (Lalpha) such that the laser (Lalpha) scans in a first direction on a XY worktable; another electric scanner which isconfigured on the light path of the laser (Lbeta) such that the laser (Lbeta) scans in a second direction on the XY worktable different than the first direction; a second polarization unit which mixes two beams of lasers; a pair of main electric scanners which enable the lasers (Lalpha, Lbeta) to scan in a third and fourth directions that are mutually different on the XY worktable; and a ftheta lens which respectively condenses the lasers (Lalpha, Lbeta) from the main electric scanners on designated positions of processed objects.
Inventors:
Mitaka Iwashita
Kenichi Ijima
Masashi Naruse
Mitsuhiro Kanada
Nobutaka Kobayashi
Takaaki Iwata
Kenichi Ijima
Masashi Naruse
Mitsuhiro Kanada
Nobutaka Kobayashi
Takaaki Iwata
Application Number:
JP2007140210A
Publication Date:
July 15, 2009
Filing Date:
May 28, 2007
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K26/067; H05K3/00; B23K101/42
Domestic Patent References:
| JP2006122988A |
Foreign References:
| WO2005118207A1 | ||||
| WO2004101211A1 |
Attorney, Agent or Firm:
Hiroaki Sakai
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