Title:
セラミック基板と金属放熱器の接合構造
Document Type and Number:
Japanese Patent JP4309522
Kind Code:
B2
Inventors:
Koji Sakamoto
Application Number:
JP24663999A
Publication Date:
August 05, 2009
Filing Date:
August 31, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/02; H05K1/03
Domestic Patent References:
| JP6310822A | ||||
| JP10326949A | ||||
| JP10224059A | ||||
| JP9057487A | ||||
| JP5194050A | ||||
| JP10264311A | ||||
| JP8162519A | ||||
| JP2044084A | ||||
| JP11147768A |
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