Title:
ウエハレベルパッケージ構造体とその製造方法、及びそのウエハレベルパッケージ構造体から分割された素子
Document Type and Number:
Japanese Patent JP4312631
Kind Code:
B2
Inventors:
Yukihisa Yoshida
Hiroshi Fukumoto
Yoshiaki Hirata
Yoshiyuki Suehiro
Hiroshi Fukumoto
Yoshiaki Hirata
Yoshiyuki Suehiro
Application Number:
JP2004058744A
Publication Date:
August 12, 2009
Filing Date:
March 03, 2004
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/12; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP6318625A | ||||
| JP4293311A | ||||
| JP11150441A | ||||
| JP2000311961A |
Attorney, Agent or Firm:
Samejima Mutsumi
Keiichi
Kyousei Tamura
Mikio Takeuchi
Keiichi
Kyousei Tamura
Mikio Takeuchi