Title:
成膜装置
Document Type and Number:
Japanese Patent JP4317608
Kind Code:
B2
Abstract:
A film deposition apparatus of the present invention includes a container forming a processing chamber for processing a target object, a mounting table which is provided in the processing chamber and on which the target object is mounted, a first heating apparatus provided in the mounting table, for heating the target object mounted on the mounting table, a first gas supply section provided in the container, for supplying processing gas into the processing chamber, the processing gas forming a high-melting-point metal-film layer on the target object mounted on the mounting table, a movable clamp for clamping a periphery of the target object and holding the target object on the mounting table, a second heating apparatus formed separately from the clamp, for heating the clamp indirectly, a gas flow path formed between the clamp and the second heating apparatus when the clamp is moved to a position where the clamp clamps the target object, and a second gas supply section for causing backside gas to flow into the gas flow path.
Inventors:
Sumi Tanaka
Yoneda Shogo
Yoneda Shogo
Application Number:
JP952999A
Publication Date:
August 19, 2009
Filing Date:
January 18, 1999
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/458; C23C16/04; C23C16/44; C23C16/455; H01L21/00; H01L21/28; H01L21/285; H01L21/687
Domestic Patent References:
JP9260469A | ||||
JP9115993A | ||||
JP9036088A | ||||
JP2228035A | ||||
JP4123257U | ||||
JP7058016A | ||||
JP6306615A | ||||
JP6208959A |
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara
Tetsuo Kanamoto
Koji Hagiwara