Title:
ダイアタッチペースト及び半導体装置
Document Type and Number:
Japanese Patent JP4341193
Kind Code:
B2
Inventors:
Nobuki Tanaka
Ichito
Ichito
Application Number:
JP2001067959A
Publication Date:
October 07, 2009
Filing Date:
March 12, 2001
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08F2/44; H01L21/52; C08F290/06; C09J175/14
Domestic Patent References:
| JP11241058A | ||||
| JP8134376A | ||||
| JP11279458A |