Title:
セラミックス回路基板及びこれを用いたパワー半導体モジュール
Document Type and Number:
Japanese Patent JP4345066
Kind Code:
B2
Abstract:
To prevent any crack of a ceramic circuit board with an extrusion portion, to improve flexural strength, and to prevent short circuit and the like.
In the ceramic circuit board in which circuit patterns comprising a metal plate are formed by forming a wax material layer along a plurality of circuit patterns in at least one surface of the ceramic circuit board, jointing the metal plate through the wax material layer, and etching the garbage of the metal plate, and an extrusion portion by the wax material layer protruded from a felly of the metal plate is formed, the maximum surface roughness Rmax of the extrusion portion is 5-50 μm.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Toshiyuki Imamura
Junichi Watanabe
Junichi Watanabe
Application Number:
JP2005150960A
Publication Date:
October 14, 2009
Filing Date:
May 24, 2005
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
H05K1/02; H05K3/38; H01L23/14; H05K1/03
Domestic Patent References:
| JP11340598A | ||||
| JP4170089A | ||||
| JP2002185089A | ||||
| JP6107471A |