Title:
ポジ型レジスト組成物
Document Type and Number:
Japanese Patent JP4377174
Kind Code:
B2
Abstract:
A positive resist composition comprising (A) a resin containing at least one group that is decomposed by the action of an acid to generate an alkali-soluble group and (B) at least two compounds selected from (B1) a compound that generates an aliphatic or aromatic sulfonic acid substituted with at least one fluorine atom, (B2) a compound that generates an aliphatic or aromatic sulfonic acid that does not contain a fluorine atom, (B3) a compound that generates an aliphatic or aromatic carboxylic acid substituted with at least one fluorine atom and (B4) a compound that generates an aliphatic or aromatic carboxylic acid that does not contain a fluorine atom, as (B) a compound that generates an acid upon irradiation of an actinic ray or radiation, wherein the group that is decomposed by the action of an acid contained in the resin (A) includes a group represented by formula (Y) defined in the specification.
More Like This:
JP7357034 | Salt and photoresists containing salt |
WO/2010/095698 | POLYMER, RADIATION-SENSITIVE COMPOSITION, AND MONOMER |
JP5639795 | Resist pattern formation method |
Inventors:
Inabe Haruki
Tomoya Sasaki
Tomoya Sasaki
Application Number:
JP2003280237A
Publication Date:
December 02, 2009
Filing Date:
July 25, 2003
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08F20/28; G03C1/76; G03F7/004; H01L21/027
Domestic Patent References:
JP11125907A | ||||
JP2003107707A | ||||
JP2003015301A | ||||
JP2001249460A | ||||
JP2000241965A |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa