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Title:
プリント基板の検査方法およびこれに用いる装置
Document Type and Number:
Japanese Patent JP4386326
Kind Code:
B2
Abstract:

To detect simply and surely a failure of a circuit pattern such as a defect or a minute flaw, concerning a printed circuit board having a trend of miniaturization and densification.

This device has a spectral camera 3 for detecting a spectrum on this printed circuit board 1, a spectral image taking part 4 for taking a spectral image detected by the camera 3, an analysis part 7 for analyzing the image taken by the taking part 4, a central processing part 11 for executing processing, or the like. Irradiation of illumination to the printed circuit board is executed from the tilted direction toward the board face of the printed circuit board. At the irradiation time of illumination from the tilted direction toward the board face of the printed circuit board, irradiation is executed from at least two mutually different directions.

COPYRIGHT: (C)2003,JPO


Inventors:
Hideaki Ogawa
Application Number:
JP2002006762A
Publication Date:
December 16, 2009
Filing Date:
January 15, 2002
Export Citation:
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Assignee:
Hypertech Co., Ltd.
International Classes:
G01R31/02; G01J3/36; G01N21/956; H05K3/00
Domestic Patent References:
JP2001272339A
JP9145476A
JP7120399A
JP2000249659A
JP2000171409A
JP200036698A
JP61278738A
Attorney, Agent or Firm:
Ichiro Kudo



 
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