Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4393773
Kind Code:
B2
Inventors:
Noriyuki Miura
Application Number:
JP2003045331A
Publication Date:
January 06, 2010
Filing Date:
February 24, 2003
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H01L21/265; H01L21/28; H01L21/336; H01L29/423; H01L29/49; H01L29/786
Domestic Patent References:
| JP11330475A | ||||
| JP7162011A | ||||
| JP8148679A | ||||
| JP10247734A | ||||
| JP11195789A | ||||
| JP5235350A | ||||
| JP2001358330A | ||||
| JP1197554A | ||||
| JP6273768A | ||||
| JP9260649A |
Attorney, Agent or Firm:
Minoru Maeda
Youichi Yamagata
Masahiko Shinohara
Youichi Yamagata
Masahiko Shinohara