To provide a design system for a semiconductor device which permits the evaluation of finally expected cost at the initial stage of the design of a three-dimensional mounting circuit.
The design system is provided with an arrangement connection information storage means 2 for storing arrangement data, die shape data, terminal data and connection data of each die, a wiring rule storage means 7, a cost calculating formula storage means 10 for storing a cost calculating formula by cost calculation parameters including the height of a stacked die, a step count, a plane view area and a necessary substrate area, a three-dimensional information calculation means 3 for calculating the height of the die, a lamination layer stage count and a plane view area, a wiring terminal coordinate calculating means 5, a virtual wiring means 8 which performs virtual wiring among respective wiring terminals designated by the connection data and calculates a substrate area necessary for the virtual wiring, and a cost calculating means 11 which uses the cost calculation parameters to calculate cost by the cost calculating formula.
COPYRIGHT: (C)2006,JPO&NCIPI
Cui cloud
Kawase English Road
Minako Mikami
Fumiaki Shigeoka
Hiroyuki Kataoka
Seiichiro Yoshida
Naoto Ishibashi
Matsuoka Tsunehiro
Otsuru Eisa Saku
Yoichi Ieri
Ueno Seiki Co., Ltd.
Gedat Innovation Co., Ltd.
New Japan Radio Co., Ltd.
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