Title:
電気的接続材料
Document Type and Number:
Japanese Patent JP4411819
Kind Code:
B2
Abstract:
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is'an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
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Inventors:
Honda line
Nobuhiro Hanai
Masakazu Nakata
Nobuhiro Hanai
Masakazu Nakata
Application Number:
JP2001569929A
Publication Date:
February 10, 2010
Filing Date:
March 23, 2001
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01R11/01; H01L21/56; H01L21/60; H01R4/04; H01R43/00; H05K3/32
Domestic Patent References:
| JP62500828A | ||||
| JP6150995A | ||||
| JP5290911A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hidemori Matsukuma
Hironobu Isoyama
Hidemori Matsukuma