Title:
部品内蔵モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP4424449
Kind Code:
B2
Abstract:
[Problem] To provide a reliable component-embedded module that allows a reduction in cost and an increase in yield. [Solving Means] A component-embedded module A includes a module substrate 1 having wiring electrodes 2 on the upper surface thereof, first circuit components 7 mounted on the wiring electrodes 2, a sub-module 10 disposed on an area on which no wiring electrodes 2 are formed, and an insulating resin layer 20 formed on the entire upper surface of the module substrate in such a manner that the insulating resin layer 20 covers at least parts of the first circuit components and sub-module. The second circuit components 15 including an integrated circuit element are mounted on the sub-module 10 or embedded therein. Via conductors 3 are formed through the module substrate 1 from the lower surface thereof and are directly coupled to terminal electrodes 14 on the lower surface of the sub-module 10. By using a substrate having a wiring accuracy higher than that of the module substrate 1, a reliable component-embedded module is obtained.
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Inventors:
Kazuyuki Yuda
Tsutomu Ieki
Tsutomu Ieki
Application Number:
JP2009512911A
Publication Date:
March 03, 2010
Filing Date:
April 11, 2008
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46
Domestic Patent References:
| JP5136558A | ||||
| JP2006019361A | ||||
| JP2002344146A | ||||
| JP2007067369A | ||||
| JP2006032402A | ||||
| JP2006173167A | ||||
| JP11040918A | ||||
| JP2005251904A | ||||
| JP2001177043A | ||||
| JP8191128A | ||||
| JP2002110717A |
Foreign References:
| WO2007034629A1 | ||||
| WO2007072616A1 |
Attorney, Agent or Firm:
Hidetaka Tsutsui