Title:
ボンディング方法、ボンディング装置及び製造方法
Document Type and Number:
Japanese Patent JP4425319
Kind Code:
B1
Abstract:
Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.
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Inventors:
Nobuyuki Aoyagi
Hiroaki Yoshino
Hiroaki Yoshino
Application Number:
JP2008232444A
Publication Date:
March 03, 2010
Filing Date:
September 10, 2008
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP2005167054A | ||||
| JP2006303168A | ||||
| JP2008021839A | ||||
| JP2005235846A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Osaka Koichi
Yoshiki Kuroki
Osaka Koichi