Title:
半導体装置
Document Type and Number:
Japanese Patent JP4434757
Kind Code:
B2
Abstract:
To provide a semiconductor device preventing breakage or irreversible deformation of an element structure even if the semiconductor device like an EL panel is deformed, and equipped with a sealing member capable of obtaining high sealing property.
The semiconductor device 1 comprises a base plate 10, and a sealing member 14 sealing a laminated semiconductor element 15 formed on the base plate 10. A contact angle at an inner face 14c of the sealing member 14 is larger than that of an outer face 25a of the semiconductor element 15 facing the sealing member 14.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Kenichi Nagayama
Application Number:
JP2004012822A
Publication Date:
March 17, 2010
Filing Date:
January 21, 2004
Export Citation:
Assignee:
Pioneer Corporation
International Classes:
H05B33/04; H01L51/50; H05B33/02; H05B33/14
Domestic Patent References:
| JP7192867A | ||||
| JP2002208478A | ||||
| JP2003257624A |
Attorney, Agent or Firm:
Motohiko Fujimura