Title:
圧接型半導体装置
Document Type and Number:
Japanese Patent JP4439696
Kind Code:
B2
Inventors:
Kenichi Nodera
Application Number:
JP2000239232A
Publication Date:
March 24, 2010
Filing Date:
August 08, 2000
Export Citation:
Assignee:
Nippon Inter Co., Ltd.
International Classes:
H01L23/00; H01L23/48
Domestic Patent References:
| JP51118371A | ||||
| JP52110342U | ||||
| JP57175441U |
Attorney, Agent or Firm:
Kozo Sakakibara