Title:
樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP4439752
Kind Code:
B2
Inventors:
Kotaro Sato
Application Number:
JP2001053250A
Publication Date:
March 24, 2010
Filing Date:
February 28, 2001
Export Citation:
Assignee:
Nippon Inter Co., Ltd.
International Classes:
H01L23/28
Domestic Patent References:
| JP46002372A | ||||
| JP2280362A |
Attorney, Agent or Firm:
Hiroki Sasai