Title:
電子部品用セラミックス基板
Document Type and Number:
Japanese Patent JP4442964
Kind Code:
B2
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Inventors:
Tadahiro Okamoto
Application Number:
JP31001499A
Publication Date:
March 31, 2010
Filing Date:
October 29, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/02; B28B11/12; C04B35/00
Domestic Patent References:
| JP9011221A | ||||
| JP10135583A | ||||
| JP1237432A | ||||
| JP9008416A | ||||
| JP7014667U | ||||
| JP62211805A | ||||
| JP4059905U | ||||
| JP9129992A | ||||
| JP2018903A |