Title:
コネクタ、プリンタヘッド及び半導体チップの結線方法
Document Type and Number:
Japanese Patent JP4447842
Kind Code:
B2
Inventors:
Takayuki Shigeyuki
Akihito Miyazaki
Hiroyasu Uchida
Akihito Miyazaki
Hiroyasu Uchida
Application Number:
JP2003030124A
Publication Date:
April 07, 2010
Filing Date:
February 06, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B41J2/05; H01R9/00; H05K1/18
Domestic Patent References:
| JP359843U | ||||
| JP200334031A | ||||
| JP46768A | ||||
| JP620731A | ||||
| JP6163125A | ||||
| JP550671U | ||||
| JP736370U | ||||
| JP200236586A |
Attorney, Agent or Firm:
Tadashi Nakamura