Title:
回路構成体の製造方法および機能カードの製造方法
Document Type and Number:
Japanese Patent JP4468746
Kind Code:
B2
Inventors:
Komiya Kazuki
Masateru Watanabe
Hidenori Yasukawa
Masateru Watanabe
Hidenori Yasukawa
Application Number:
JP2004181993A
Publication Date:
May 26, 2010
Filing Date:
June 21, 2004
Export Citation:
Assignee:
Toyo Aluminum K.K.
International Classes:
G06K19/077; B42D15/10; G06K19/07
Domestic Patent References:
| JP2004046360A | ||||
| JP2001022912A | ||||
| JP2002042086A |
Attorney, Agent or Firm:
Kazuyuki Koda