Title:
金型装置
Document Type and Number:
Japanese Patent JP4471248
Kind Code:
B2
Inventors:
Hideyuki Moriya
Application Number:
JP2000234963A
Publication Date:
June 02, 2010
Filing Date:
August 02, 2000
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B21D28/14
Domestic Patent References:
| JP7241627A | ||||
| JP62057895A | ||||
| JP7032212A | ||||
| JP10263721A | ||||
| JP11319984A | ||||
| JP10235434A | ||||
| JP11147136A |
Foreign References:
| WO2000023210A1 |
Attorney, Agent or Firm:
Akira Saito