To provide a pressure-sensitive adhesive tape for dicing a semiconductor wafer in which the generation of mustache-shaped chips is reduced and a problem is not generated in a wafer dicing in a dicing process for the wafer.
One surface of a base-material film is coated with a pressure-sensitive adhesive in the pressure-sensitive adhesive tape for dicing a semiconductor. In the tape, the base-material film is composed of at least two layers, and the melting point of a resin in a layer brought into contact with a pressure-sensitive adhesive layer in the film is 130 to 240°C. In the tape, at least one layer besides the layer brought into contact with the pressure-sensitive adhesive layer is composed of a resin composition consisting of the hydrogen additive of 20 to 400 mass pt. of a styrene-butadiene copolymer to a polypropylene resin of 100 mass pt..
COPYRIGHT: (C)2005,JPO&NCIPI
Yabuki Akira
Shozo Yano
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| JP2003158098A | ||||
| JP2003257893A |