Title:
半導体装置
Document Type and Number:
Japanese Patent JP4481359
Kind Code:
B2
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Inventors:
Shunpei Yamazaki
Application Number:
JP2009190694A
Publication Date:
June 16, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/336; G02F1/1368; H01L21/02; H01L27/12; H01L29/786
Domestic Patent References:
JP2000012864A | ||||
JP4206766A | ||||
JP10125927A | ||||
JP9008124A | ||||
JP5226620A | ||||
JP9045882A |
Attorney, Agent or Firm:
Hirokuni Kamo