Title:
加工装置
Document Type and Number:
Japanese Patent JP4481698
Kind Code:
B2
Abstract:
A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, includes a supplier for supplying the resist between the substrate and the mold, and an illumination optical system for illuminating ultraviolet light onto the resist via the mold so as to cure the resist.
Inventors:
Toshinobu Tokita
Hirohisa Ota
Eigo Kawakami
Takashi Nakamura
Kazuyuki Harumi
Hirohisa Ota
Eigo Kawakami
Takashi Nakamura
Kazuyuki Harumi
Application Number:
JP2004096992A
Publication Date:
June 16, 2010
Filing Date:
March 29, 2004
Export Citation:
Assignee:
Canon Inc
International Classes:
G03F7/20; H01L21/027; B29C43/02; B81C99/00; G03F7/00
Domestic Patent References:
| JP2000269122A | ||||
| JP2003158067A | ||||
| JP10106921A | ||||
| JP2003218007A | ||||
| JP61137246A |
Foreign References:
| WO2004016406A1 |
Attorney, Agent or Firm:
Ryosuke Fujimoto