Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4485783
Kind Code:
B2
Inventors:
Iwa saki Akihisa
Shunsuke Isono
Kazuro Tomita
Keiji Hashimoto
Shunsuke Isono
Kazuro Tomita
Keiji Hashimoto
Application Number:
JP2003386564A
Publication Date:
June 23, 2010
Filing Date:
November 17, 2003
Export Citation:
Assignee:
Panasonic Corporation
Renesas Technology Corp.
Renesas Technology Corp.
International Classes:
G03F7/004; H01L21/027; G03F7/11; G03F7/40; G03F7/42; H01L21/304; H01L21/3065; H01L21/3205
Domestic Patent References:
| JP2003228180A | ||||
| JP2003280219A | ||||
| JP2003229481A | ||||
| JP2002252222A | ||||
| JP10154694A | ||||
| JP2002158206A |
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Yuji Takeuchi
Katsumi Imae
Tomoo Harada
Hiroshi Koyama
Hiroshi Takeuchi
Yuji Takeuchi
Katsumi Imae
Tomoo Harada