Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP4489698
Kind Code:
B2
Abstract:
A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.
Inventors:
Megumi Hirata
Koji Kitayama
Mizuho Maeda
Koji Kitayama
Mizuho Maeda
Application Number:
JP2005502836A
Publication Date:
June 23, 2010
Filing Date:
February 17, 2004
Export Citation:
Assignee:
KURARAY CO.,LTD.
International Classes:
C08G59/34; C08F283/10; C08L63/08; H01L23/29; H01L23/31; G03F7/038
Domestic Patent References:
| JP1180681A | ||||
| JP6142504A |
Attorney, Agent or Firm:
Koji Makimura
Toru Suzuki
Yoshiko Yamoto
Toru Suzuki
Yoshiko Yamoto