Title:
半導体装置用ソケット
Document Type and Number:
Japanese Patent JP4495200
Kind Code:
B2
Abstract:
A pressing surface portion of a presser member for selectively holding a semiconductor device is supported to be movable upward and downward in accordance with the up/down motion of a cover member to be close to or away from a alignment plate, as well as to be rotatable between a position directly above the alignment plate and a predetermined waiting position.
More Like This:
| JPH10321332 | SOCKET FOR ELECTRONIC PACKAGE |
| JP4647335 | IC socket |
| JP5677104 | Socket for electrical components |
Inventors:
Utsuji Kazumi
Hideki Sato
Hideki Sato
Application Number:
JP2007256211A
Publication Date:
June 30, 2010
Filing Date:
September 28, 2007
Export Citation:
Assignee:
Yamaichi Electric Co., Ltd.
International Classes:
H01R33/76; H01L23/32
Domestic Patent References:
| JP11162602A | ||||
| JP2005216728A | ||||
| JP2004079227A |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe