半導体装置及びその製造方法

Title:

半導体装置及びその製造方法

Document Type and Number:

Japanese Patent JP4497304

Kind Code:

B2

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Inventors:

Hidehiro Takeshima
Toru Saga
Fumio Watanabe

Application Number:

JP2004337366A

Publication Date:

July 07, 2010

Filing Date:

November 22, 2004

Export Citation:

Assignee:

Elpida Memory Co., Ltd.

International Classes:

H01L23/12

Domestic Patent References:

Attorney, Agent or Firm:

Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata

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