Title:
テープ状基板への電子部品の実装方法及び実装装置
Document Type and Number:
Japanese Patent JP4510329
Kind Code:
B2
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Inventors:
Akihiro Yamamoto
Naoto Hosoya
Naoto Hosoya
Application Number:
JP2001183533A
Publication Date:
July 21, 2010
Filing Date:
June 18, 2001
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H05K13/00; H05K13/04
Domestic Patent References:
| JP2116192A | ||||
| JP11121915A | ||||
| JP10041694A | ||||
| JP9331143A | ||||
| JP11282997A | ||||
| JP10276000A | ||||
| JP2000351063A | ||||
| JP10261896A | ||||
| JP8213745A | ||||
| JP9023055A | ||||
| JP8175593A | ||||
| JP11026922A |
Attorney, Agent or Firm:
Aoyama Aoi
Mitsuo Wada
Mitsuo Wada